R&D Core Technology

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R&D Core Technology

R&D Core Technology

COB-type LED module with built-in heat radiatingrod and heat-resistant lens to improve waterproof function and heat radiation
(Patent No. 10-1598045)

Through its patented heat sinks and structuresdesigned to directly contact the LEDs, the heat generated from the LEDs and thelenses is transferred directly to the outside, which allows heat to betransferred to the module heat sink through the LED bottom surface, Maximizingheat dissipation performance

Improved COB LED package (Patent No.10-1634950)

  • - Eliminate insulation layer at the lower end of COB chip, minimize heat resistance, improve heat dissipation performance of COB chip
  • - Maximize optical output through COB chip lower mirror processing
  • - Minimize optical loss due to chip-to-chip interference by applying radial type chip bonding
  • - Improvement of light efficiency by preventing light loss by zener diode for LED protection
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